Warmtepad Thermal Grizzly KryoSheet TG-KS-25-25

Thermal Grizzly KryoSheet TG-KS-25-25 is a high-performance graphene thermal pad measuring 25 mm x 25 mm in anthracite color. It is designed as an alternative to high-end thermal pastes and carbon-based pads, offering very high and stable thermal conductivity without liquid components, which prevents drying out and long-term degradation associated with conventional thermal pastes.

Advantages

KryoSheet pads provide significantly higher thermal conductivity compared with Carbonaut pads due to both the choice of graphene material and an innovative manufacturing process. The pads have a conformable surface for good contact with components, lack liquid components so they do not dry out over time, and maintain constant thermal performance thanks to a Z-direction molecular stacking that exploits graphite anisotropy.

Suitable for

• Thermal coupling between small electronic components and heatsinks (e.g., chips, MOSFETs, VRMs)
• High-performance cooling setups where stable long-term conductivity is required
• Applications where a non-liquid, maintenance-free thermal interface is preferred

Key specifications

• Brand: Thermal Grizzly
• Model / MPN: TG-KS-25-25
• Size: 25 mm x 25 mm
• Colour: Anthracite
• Pack quantity: 1 piece
• Type: Graphene thermal pad (dry, no liquid components)

How to use

Place the KryoSheet pad between the heat-generating component and the heatsink, ensuring both contact surfaces are clean and free of dust or grease. Trim the pad to the required size if necessary, then align and press gently to achieve conformal contact. Follow device-specific thermal interface guidelines and observed clearances to avoid electrical shorts, since KryoSheet can exhibit increased electrical conductivity compared with some other pads.

Recommendations

Use KryoSheet according to manufacturer instructions: avoid placing the pad where it could create unintended electrical contact, ensure correct thickness and coverage for effective thermal transfer, and do not use the pad in situations that require a non-conductive thermal interface unless proper insulation is applied.